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Quality-oriented: Infineon launches the world's first industrial-grade eSIM card with micro-package

Munich, Germany, December 24, 2018—M2M communication in the Internet of Things (IoT) requires reliable data collection and uninterrupted data transmission. In order to take full advantage of the ubiquitous mobile network, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launched the world’s first industrial-grade embedded SIM (eSIM) card using a miniature wafer-level chip-scale package (WLCSP) . Industrial machine and equipment manufacturers, from vending machines to remote sensors to asset trackers, can use this to optimize the design of their IoT devices without compromising safety and quality.
 
The deployment of eSIM cards can bring many advantages and facilitate the smooth adoption of cellular connections in industrial environments. The eSIM card occupies a small space and can help equipment manufacturers improve design flexibility. And, thanks to a single SKU (stock keeping unit), they can also simplify the manufacturing process and global distribution. In addition, if the network coverage is insufficient, or a more favorable contract can be signed with other mobile operators, customers can also change mobile service providers at any time.
 
However, it is still a challenge for semiconductor suppliers to achieve robust quality in a small space and normal use under the harshest conditions. Infineon is now one step ahead in meeting this challenge: Infineon’s SLM 97 safety controller uses a wafer-level chip-scale package (WLCSP) with a size of only 2.5mm x 2.7mm and an extended operating temperature range of -40° C to 105°C. It provides a series of high-end features and fully complies with the latest eSIM specifications released by GSMA. The robust quality and high durability of the industrial-grade eSIM card application reflects Infineon's high-quality and "zero defect" philosophy.
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